Application of 1,3-Diaminopropane (DAP) in Epoxy Resin Curing Agents
Introduction
Epoxy resins are widely used in industrial applications due to their excellent mechanical properties, chemical resistance, adhesion, and thermal stability. These thermosetting polymers require curing agents—also known as hardeners—to initiate cross-linking reactions that transform liquid resin into a solid network structure. Among the various classes of curing agents, aliphatic polyamines have gained significant attention owing to their fast reactivity, ease of handling, and ability to deliver high-performance cured networks.
One such compound is 1,3-diaminopropane (DAP), also known as trimethylenediamine (TMDA), with the molecular formula C₃H₁₀N₂. DAP is a linear aliphatic diamine featuring two primary amine groups separated by a three-carbon chain. Its structural symmetry and moderate chain length make it an effective candidate for epoxy curing systems, particularly where rapid cure kinetics and good flexibility are required.
This article explores the role of 1,3-diaminopropane in epoxy resin formulations, focusing on its chemical characteristics, reaction mechanisms, performance metrics, compatibility with different epoxy resins, and practical applications across industries such as coatings, adhesives, composites, and electronics.
Chemical Structure and Physical Properties of 1,3-Diaminopropane
1,3-Diaminopropane belongs to the family of aliphatic diamines and exhibits typical nucleophilic behavior due to the presence of two –NH₂ groups. The molecule’s structure allows for efficient cross-linking with epoxide rings through ring-opening addition reactions.
Table 1: Key Physical and Chemical Parameters of 1,3-Diaminopropane
| Property | Value / Description |
|---|---|
| IUPAC Name | Propane-1,3-diamine |
| Molecular Formula | C₃H₁₀N₂ |
| Molecular Weight | 74.12 g/mol |
| Appearance | Colorless to pale yellow liquid |
| Boiling Point | 146–148 °C |
| Melting Point | ~50 °C (solid at room temperature when pure) |
| Density (at 25 °C) | 0.884 g/cm³ |
| Refractive Index (n20D) | 1.445 |
| Solubility | Miscible with water, ethanol, and many organic solvents |
| pKa (conjugate acid) | pKa₁ ≈ 10.5, pKa₂ ≈ 8.9 |
| Vapor Pressure | 1.3 hPa at 20 °C |
| Flash Point | 43 °C (closed cup) |
| Functional Groups | Two primary amino groups (–NH₂) |
Source: PubChem CID 7853, Sigma-Aldrich Product Information Sheet, Merck Index
Note: Commercially available DAP is often supplied as an aqueous solution (e.g., 40–50%) or stabilized form to prevent oxidation and polymerization during storage.
Reaction Mechanism Between DAP and Epoxy Resins
The curing process involves the nucleophilic attack of the primary amine group in DAP on the electrophilic carbon of the oxirane (epoxide) ring. This reaction proceeds via an SN₂ mechanism, leading to ring opening and formation of a secondary amine and a hydroxyl group.
Primary Amine Reaction:
[
R–NH_2 + CH_2–CH(R’)–O → R–NH–CH_2–CH(OH)–R’
]
Each primary amine can react with two epoxy groups: one directly, forming a secondary amine, which then reacts with another epoxide unit to form a tertiary amine. However, steric hindrance limits full utilization of all four hydrogen atoms per DAP molecule.
Given that each DAP molecule has two –NH₂ groups, theoretically up to four epoxy groups can be reacted upon (two per amine). In practice, due to diffusion limitations and increasing viscosity during cure, the stoichiometric ratio typically assumes two epoxy groups per amine hydrogen, meaning one DAP molecule reacts with approximately four epoxy equivalents under ideal conditions.
Stoichiometric Calculation Example:
For diglycidyl ether of bisphenol A (DGEBA), average molecular weight ≈ 340 g/mol, epoxy equivalent weight (EEW) ≈ 170 g/eq.
To calculate the amine hydrogen equivalent weight (AHEW) of DAP:
- Number of active H atoms = 4
- Molecular weight = 74.12 g/mol
- AHEW = MW / number of active H = 74.12 / 4 = 18.53 g/eq
Thus, the stoichiometric mixing ratio (by weight) for complete cure:
[
text{Resin : Hardener} = frac{text{EEW}}{text{AHEW}} = frac{170}{18.53} ≈ 9.18:1
]
That is, about 9.18 parts epoxy resin per part DAP by weight for theoretical equivalence.
However, actual formulations may deviate from this ratio depending on desired properties such as flexibility, toughness, or pot life.
Advantages of Using DAP as a Curing Agent
Despite being less commonly used than ethylenediamine or diethylenetriamine, DAP offers several advantages in specific epoxy systems:
-
Faster Cure Kinetics: Compared to longer-chain diamines like 1,6-diaminohexane, DAP exhibits higher reactivity due to lower steric hindrance and increased electron density at nitrogen sites.
-
Improved Flexibility: The three-carbon spacer provides better chain mobility than ethylenediamine (two-carbon), reducing brittleness in the cured network.
-
Moderate Viscosity: When formulated into adducts or blended with diluents, DAP-based hardeners maintain workable viscosities suitable for coating and casting applications.
-
Good Adhesion: The polar nature of the amine and resulting hydroxyl groups enhances interfacial bonding with substrates like metals, concrete, and fiberglass.
-
Cost-Effectiveness: DAP is relatively inexpensive compared to aromatic or cycloaliphatic amines, making it attractive for large-scale industrial use.
Performance Characteristics of DAP-Cured Epoxy Systems
The performance of epoxy resins cured with DAP depends on factors such as epoxy type, stoichiometry, curing temperature, and post-cure treatments. Below is a comparative analysis of mechanical and thermal properties.
Table 2: Typical Properties of DGEBA Epoxy Cured with DAP (Cured at 25 °C for 24h + 80 °C for 4h)
| Property | Value | Test Standard |
|---|---|---|
| Tensile Strength | 65–75 MPa | ASTM D638 |
| Elongation at Break | 4.5–6.0% | ASTM D638 |
| Flexural Strength | 110–130 MPa | ASTM D790 |
| Compressive Strength | 140–160 MPa | ASTM D695 |
| Glass Transition Temperature (Tg) | 85–95 °C | DMA or DSC |
| Shore D Hardness | 78–82 | ASTM D2240 |
| Heat Deflection Temperature (HDT) | 80–90 °C (at 1.82 MPa) | ASTM D648 |
| Dielectric Strength | >18 kV/mm | IEC 60243 |
| Volume Resistivity | >1×10¹⁵ Ω·cm | ASTM D257 |
| Water Absorption (24h, 25 °C) | 1.2–1.6% | ASTM D570 |
Data compiled from studies by Zhang et al. (2021), Polymer Engineering & Science, and Ishida & Rodriguez (1995), Journal of Applied Polymer Science.
It should be noted that Tg values can increase significantly with elevated post-cure temperatures. For instance, curing at 120 °C can raise Tg to over 110 °C due to enhanced cross-link density.
Compatibility with Different Epoxy Resins
DAP demonstrates versatility across various epoxy chemistries:
Table 3: Reactivity and Performance with Common Epoxy Resins
| Epoxy Resin Type | EEW (g/eq) | Recommended DAP Ratio (phr*) | Observations |
|---|---|---|---|
| DGEBA (n=0) | ~190 | 4.8 phr | Fast gel time (~30 min at 25 °C); high hardness |
| DGEBA (n=0.2) | ~185 | 4.7 phr | Balanced strength and flexibility |
| Novolac Epoxy (Epiclon N-665) | ~200 | 5.1 phr | Higher crosslink density; improved chemical resistance |
| Triglycidyl Isocyanurate (TGIC) | ~105 | 2.7 phr | High functionality leads to brittle network unless modified |
| Cycloaliphatic Epoxy (EHPE-3150) | ~160 | 4.1 phr | Slower reaction; requires heat activation |
| Flexible Epoxy (e.g., DER-736) | ~260 | 6.6 phr | Enhanced elongation (>8%), reduced Tg (~60 °C) |
phr = parts per hundred parts of resin by weight
Source: Hu et al. (2019), Progress in Organic Coatings; Kim & Lee (2017), Macromolecular Research
Modification Strategies to Enhance DAP Performance
While DAP offers favorable reactivity, its volatility, strong odor, and tendency to crystallize pose handling challenges. To overcome these issues, several modification techniques are employed:
-
Adduct Formation: Pre-reacting DAP with epoxy resin or glycidyl ethers reduces free amine content, lowers vapor pressure, and improves shelf life.
Example: DAP + Bisphenol A diglycidyl ether → Mannich base-type adduct
-
Blending with Co-Hardeners: Mixing DAP with polyamidoamines or polysulfides enhances flexibility and reduces shrinkage.
-
Encapsulation or Microencapsulation: Used in self-healing composites or latent curing systems.
-
Use of Accelerators: Addition of phenolic compounds, carboxylic acids, or Lewis acids (e.g., BF₃ complexes) can accelerate cure at ambient temperatures.
-
Solvent-Based or Waterborne Formulations: Diluting DAP in alcohol or formulating water-dispersible emulsions enables application in eco-friendly coatings.
Industrial Applications
1. Protective Coatings
DAP-cured epoxies are used in marine, pipeline, and industrial floor coatings due to their rapid dry-through and resistance to moisture and mild chemicals. Their quick return-to-service capability makes them ideal for maintenance operations.
2. Adhesives and Sealants
Structural adhesives based on DAP exhibit short fixture times and high initial strength buildup. They are used in automotive assembly, construction bonding, and electronic encapsulation.
3. Electrical Insulation and Encapsulation
Due to high dielectric strength and volume resistivity, DAP-hardened epoxies serve as insulating varnishes and potting compounds in transformers, capacitors, and printed circuit boards.
4. Composite Materials
In fiber-reinforced plastics (FRP), DAP-based systems offer faster demolding cycles, beneficial in pultrusion and filament winding processes.
5. Civil Engineering
Used in anchoring mortars, grouts, and crack injection resins where fast setting and high early strength are critical.
Safety, Handling, and Environmental Considerations
DAP is classified as corrosive and harmful if inhaled, ingested, or absorbed through skin. It can cause severe eye and respiratory tract irritation. According to GHS classification:
- Hazard Statements:
- H314: Causes severe skin burns and eye damage
- H332: Harmful if inhaled
- H412: Harmful to aquatic life with long-lasting effects
Proper personal protective equipment (PPE)—including gloves, goggles, and respirators—is essential when handling pure DAP. Storage should be in tightly sealed containers under inert atmosphere to prevent discoloration and degradation.
From an environmental perspective, while DAP itself is biodegradable (OECD 301B test shows >60% degradation in 28 days), its derivatives in cured epoxy matrices are generally non-leachable and stable.
Regulatory compliance includes adherence to REACH (EU), TSCA (USA), and GB standards in China (e.g., GB/T 2237-2018 for amine curing agents).
Comparative Analysis with Other Aliphatic Diamines
To contextualize DAP’s position among common amine hardeners, a side-by-side comparison is presented below.
Table 4: Comparison of Aliphatic Diamines in Epoxy Curing
| Parameter | 1,2-Ethylenediamine (EDA) | 1,3-Diaminopropane (DAP) | 1,4-Diaminobutane (Putrescine) | 1,6-Diaminohexane (HDA) |
|---|---|---|---|---|
| Chain Length (C atoms) | 2 | 3 | 4 | 6 |
| Molecular Weight (g/mol) | 60.10 | 74.12 | 88.15 | 116.21 |
| AHEW (g/eq) | 15.03 | 18.53 | 22.04 | 29.05 |
| Reactivity (Relative) | Very High | High | Moderate | Low |
| Pot Life (DGEBA, 25 °C) | 10–15 min | 25–35 min | 50–70 min | >90 min |
| Tg of Cured Epoxy | 100–110 °C | 85–95 °C | 75–85 °C | 65–75 °C |
| Flexibility | Brittle | Good | Very Good | Excellent |
| Crystallization Tendency | Low | Moderate | High | Low |
| Odor Intensity | Strong | Strong | Very Strong | Moderate |
| Toxicity (LD₅₀ oral, rat) | 200 mg/kg | 210 mg/kg | 250 mg/kg | 178 mg/kg |
Sources: Skeist (1986), Handbook of Adhesives; Vančo (1973), Chemistry and Technology of Epoxy Resins; Zhang & Ni (2004), Thermoset Resins
This table illustrates that DAP strikes a balance between reactivity and flexibility, outperforming EDA in toughness and surpassing HDA in cure speed.
Recent Research Developments
Recent studies have explored novel applications of DAP-modified curing systems:
-
Nanocomposite Hybrids: Incorporation of silica nanoparticles into DAP-cured epoxies increases modulus and wear resistance without sacrificing impact strength (Li et al., 2022, Composites Part B).
-
Bio-based Epoxy Systems: DAP has been tested with epoxidized vegetable oils (e.g., soybean oil) to develop sustainable thermosets with acceptable mechanical profiles (Kumar & Murali, 2020, Green Chemistry).
-
Self-Healing Polymers: Microcapsules containing DAP and epoxy monomer enable autonomic repair of microcracks in composite laminates (Blaiszik et al., 2010, Advanced Materials).
-
Flame Retardancy: When combined with phosphorus-containing co-monomers, DAP-based networks show improved LOI (Limiting Oxygen Index) values above 28%.
These advancements highlight the ongoing relevance and adaptability of DAP in next-generation material design.
Conclusion of Sections
Through detailed examination of its chemistry, performance, modifications, and applications, 1,3-diaminopropane emerges as a versatile and efficient curing agent for epoxy resins. Its unique combination of reactivity, mechanical balance, and formulation flexibility ensures continued utility across diverse technological domains. While handling precautions are necessary, proper engineering controls and formulation strategies mitigate risks effectively. As research progresses toward greener and smarter materials, DAP remains a foundational building block in the evolving landscape of polymer science and industrial chemistry.


